H5TQ1G83BFR
H5TQ1G83BFR is a high-speed, low-power mobile DRAM chip by SK Hynix, commonly used in smartphones.H5TQ1G83BFR
H5TQ1G83BFR is a high-speed, low-power mobile DRAM chip by SK Hynix, commonly used in smartphones.
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Manufacturer Part # : H5TQ1G83BFR
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Package/Case: BGA
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Brand: SKHYNIX
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Product Categories : DRAMs
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
Example
Tape and Reel
Cut Tape
Tube or Tray
H5TQ1G83BFR DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The H5TQ1G83BFR is a NAND Flash memory chip produced by SK Hynix. It is a 8Gb density LPDDR3 SDRAM with a 1.8V power supply. This memory chip features a burst length of 16 and operates at speeds up to 1866MHz.The H5TQ1G83BFR is designed for use in mobile devices such as smartphones and tablets, where high performance and low power consumption are critical requirements. It is capable of delivering high-speed data transfer rates while maintaining efficiency in power usage, making it ideal for energy-sensitive applications.This memory chip also incorporates advanced features such as on-die termination and Data Strobe, which enhance signal integrity and reliability. It supports a x16 data bus width and a maximum operating temperature of 85 degrees Celsius.The H5TQ1G83BFR is packaged in a 153-ball FBGA package with dimensions of 9mm x 10.5mm, making it compact and suitable for integration into small form factor devices. Its high-performance capabilities and low power consumption make it a competitive option for manufacturers looking to develop cutting-edge mobile devices that require fast and efficient memory solutions
Key Features
- Fast data transfer rate
- Low power consumption
- High density for increased storage capacity
- 4GB capacity
- Multi-channel architecture for improved performance
- Advanced interface for seamless communication
Application
- Mobile phones
- Tablets
- Portable gaming devices
- Digital cameras
- Wearable devices
- Automotive applications
- Industrial applications
- Medical devices
- Telecommunications equipment
- Networking devices
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Case/Package | FBGA |
Specification Comparison
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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