Specification Comparison: H5TQ1G83BFR vs H5TQ1G83TFR-H9C vs H5TQ1G83BFR-H9C

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Part Number
Manufacturer SKHYNIX SKHYNIX SKHYNIX
Package BGA FBGA78 FBGA-78
Description H5TQ1G83BFR is a high-speed, low-power mobile DRAM chip by SK Hynix, commonly used in smartphones. DDR dynamic random-access memory High-density DDR SDRAM module with 128 megabytes organized in an 18-bit configuration in a Fine-pitch Ball Grid Array package with 78 pins
Stock 4614 5798 3725
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Part Package Code BGA BGA
Pin Count 78 78
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.36
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 20 ns 20 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 667 MHz 667 MHz
I/O Type COMMON COMMON
Interleaved Burst Length 4,8 4,8
JESD-30 Code R-PBGA-B78 R-PBGA-B78
JESD-609 Code e1 e1
Length 11 mm 11 mm
Memory Density 1073741824 bit 2415919104 bit
Memory IC Type DDR3 DRAM DDR3 DRAM
Memory Width 8 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 78 78
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Organization 128MX8 128MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA78,9X13,32 BGA78,9X13,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Power Supplies 1.5 V 1.5 V
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 8192
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Sequential Burst Length 4,8 4,8
Supply Current-Max 0.13 mA 0.2 mA
Supply Voltage-Max (Vsup) 1.575 V 1.575 V
Supply Voltage-Min (Vsup) 1.425 V 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 7.5 mm 7.5 mm
Case/Package FBGA
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Part Number

Start with: H5TQ1

Part Number "H5TQ1" returned 20 results; all results matched and started with "H5TQ1".

Part Number Description Brand Package/Case Lifecycle Status Cargo cycle In Stock Operation
H5TQ1G63BFR-12C

Lead-free, environmentally friendly construction

SKHYNIX BGA-96 3~7 Days 5,941.00
H5TQ1G63EFR-PBC

Cutting-edge CMOS design for improved performance

SKHYNIX FBGA96 3~7 Days 4,531.00
H5TQ1G63BFR-H9C

FPBGA-96 technology

SKHYNIX FBGA-96 3~7 Days 6,060.00
H5TQ1G83TFR

H5TQ1G83TFR is a low-power, high-speed mobile memory chip for various electronic devices.

SKHYNIX BGA 3~7 Days 6,129.00
H5TQ1G63EFR

H5TQ1G63EFR is a 3Gb LPDDR3 SDRAM chip with a speed of 1866 Mbps.

SKHYNIX BGA 3~7 Days 3,972.00
H5TQ1G63DFR-H9C

DDR DRAM, 64MX16, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96

SKHYNIX BGA-96 3~7 Days 6,551.00
H5TQ1G630FR

SKHYNIX BGA 3~7 Days 5,430.00
H5TQ1G63DFR-11C

High-density DDR DRAM module for industrial application

Sk Hynix Inc 3~7 Days 4,985.00
H5TQ163DFR-H9C

SKHYNIX 3~7 Days 4,912.00
H5TQ1G163BFR

SKHYNIX BGA 3~7 Days 1,993.00
H5TQ1G163BFR H9C

SKHYNIX BGA 3~7 Days 1,993.00
H5TQ1G163BFR-12C

SKHYNIX BGA 3~7 Days 252.00
H5TQ1G163DFR-12C

SKHYNIX BGA 3~7 Days 211.00
H5TQ1G43AFP-G7C

SKHYNIX BGA 3~7 Days 56.00
H5TQ1G43AFR-G7C

SKHYNIX FBGA 3~7 Days 2,500.00
H5TQ1G43AFR-H9C

SKHYNIX FBGA 3~7 Days 2,500.00
H5TQ1G43BFR-G7CC

SKHYNIX DDR3 256Mx4 PC1066 3~7 Days 960.00
H5TQ1G43BFR-H9C-C

SKHYNIX FBGA 3~7 Days 19,200.00
H5TQ1G43BFR-PAC

SKHYNIX FBGA 3~7 Days 571.00
H5TQ1G43BFR-PBC

SKHYNIX FBGA 3~7 Days 568.00